| 职位描述： |
Description:
Candidates will have a minimum of two years of experience in the design and development of high-speed digital electrical design of complex circuit packs. He/she should be familiar with CAD design systems, preferably Cadence, for schematic capture, signal analysis, and PCB layout
Candidates will be responsible for independently taking portions of a subsystem all the way from design to implementation and test. This will require technical strength and the ability to interact with the team to insure other subsystem parts are integrated with the overall system.
Candidates will require excellent communications skills in Mandarin and basic communication skills in English to be able to translate system requirements to actual hardware design and to effectively understand, debug and correct problems faced by the teams in China and the USA .
Candidates will require knowledge of standard hardware development processes and methodologies, and have a high commitment to hardware quality. Hands-on experience with embedded processors and exposure to developing and debugging hardware/software is required as well as exposure to use of emulators, BDM's, logic-analyzers, etc.
A bachelor's or master's degree in electrical or computer engineering is required, with experience in PowerPC, SONET, EoS, DS3, and DS1 standards highly desired.
应聘者至少要有 2 年的高速、复杂的数字电路系统设计研发经验。他 / 她应该熟悉 CAD 设计系统，最好是用过 Cadence 的原理图捕获、信号分析和 PCB 设计工具。
应聘者将负责独立地完成子系统，从设计、实施，到测试，有技术实力和与团队成员沟通的能力，以确保和其他子系统部分能集成在一个总的系统中。
应聘者要能用普通话非常流利地交流，并有基本的英语沟通能力。他 / 她要把系统需求转化为实际硬件设计，并有效地理解、调试、纠正中美团队面对的问题。
应聘者要知道规范的硬件研发流程和方法，有义务确保硬件质量。有嵌入式处理器的实际经验，需要亲自开发、调试硬件 / 软件，会使用仿真器、 BDM 、逻辑分析仪等。
应聘者应具备电子工程或计算机工程的学士学位或硕士学位，有 PowerPC 、 SONET 、 EoS 、 DS3 和 DS1 标准的知识和设计经验更佳。 |